AWA Alexander Watson Associates extended the brief for its annual conference on in-mold labeling to embrace two lively additional in-mold markets: In-mold decoration and electronics applications.
This new event – AWA IMLCON, IMDCON, and IMECON, will be held at the Novotel Amsterdam City Hotel in Amsterdam, from Sept 10-11, 2018, and will enable industry participants at all levels, and others interested in exploring the possibilities, to gain an expert update on three major pathways in in-mold manufacturing today.
AWA IMLCON, IMDCON, and IMECON will combine plenary sessions with concurrent application-specific sessions and a tabletop exhibition, to make it easy for delegates to gain in-depth insights on the topics that interest them.
With the addition of in-mold electronics to the program, participants can explore this leading-edge technology, which enables the installation of electronic circuitry into injection-molded plastic components during mainstream production, and with a much-reduced need for costly and time-consuming secondary operations.
Along with gaining the latest market data from AWA consultants, this year’s conference delegates will hear from expert speakers from the different technology streams, including Advanced Decorative Systems, Berhalter, Brigl & Bergmeister, Dupont, Elantas Europe, IMR Europe, Niebling, Serigraph, the Holst Centre (TNO), and Yupo.