“DuPont MCM is uniquely positioned to help its customers succeed in the growing field of printed electronics, and this new development is an excellent example of how we’ve put our science to work to make that happen,” said Scott Gordon, printed electronics segment manager – DuPont Microcircuit Materials.
DuPont 5064 silver conductive ink is a polymer thick film technology developed with a unique combination of silver powder and resin that provides superior conductivity, cost-effectively. It also allows for single pass printing which improves productivity in a range of printing processes. Its excellent adhesion to various substrates makes it suitable for several key applications, particularly RFID antennae, due to its performance in ultra high frequency and high frequency ranges.
DuPont 5064 silver conductive ink may also be used for applications including membrane touch switches, biosensors and interconnection circuitry.
DuPont MCM’s range of functional low-temperature curing inks for printed electronics applications employ various advanced resin chemistries enabling a variety of adhesion, flex and thermal properties and compatibility with a broad range of substrates, including paper, polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polycarbonate (PC), FR4 and transparent conductive oxides. DuPont MCM’s wide range of ink vehicle systems is suitable for screen print, flexo, gravure, photo-imaging, pad printing and other processing techniques. New inkjet formulations are also under development.