During ExpoPrint Latin America 2014, which will be held July 16-22, 2014 at the Transamerica Expo Center in São Paulo, Brazil, Sun Chemical and its parent company, DIC, will show how they work with brand owners and converters to ensure their packaging complies with the most stringent low migration and sustainability regulations in the marketplace.
“Sun Chemical leads the way in providing solutions for food packaging printing and offers materials for converters, ranging from inks and coatings to adhesives, that are specifically designed to ensure the low migration of inks on packaging,” said Fernando Tavara, president, Sun Chemical Latin America. “Our priority is always to work with our customers to help them achieve their goals, whether they include sustainability initiatives or extra protection on packaging to prevent ink migrating into food. During ExpoPrint, we’ll show solutions that can help them achieve their compliance goals.”
Visitors at Hall C, Booth 14C will learn how Sun Chemical’s full range of low migration solutions help prevent inks from migrating into food, pharmaceutical and tobacco products and meet the world’s strictest compliance measures, including the Plastics Implementing Measure, REACH, the Plastics Directive and the Swiss Ordinance.
Sun Chemical’s SunPak LMQ products help address the risk brand owners face in food and pharmaceutical packaging, where compounds from materials in the packaging structure can migrate into the product or the surrounding environment. SunPak LMQ inks exhibit very low odor, off-flavor and migration levels, and offer a comprehensive solution to brand owners and converters who are looking for ways to address migration concerns for food, pharmaceutical and tobacco applications.
During the show, Sun Chemical will showcase its SunBar Oxygen Barrier Coatings. Designed to enable lightweighting of packaging by removing the metal foil and one layer of adhesive from packaging, as well as offering improved laminate flexibility, SunBar oxygen barrier coatings offer a smooth, homogenous, pinhole-free layer that is easily overprinted with inks and can be laminated to a variety of secondary films. SunBar is cost-effective, recyclable, biodegradable and press-ready, allowing for lighter-weight packaging, a reduced carbon footprint, superior barrier protection for foodstuffs and easy application with few changes to current equipment.
Also on display will be the SunLam family of performance lamination adhesives. Initially developed by DIC for the demanding Asian market to offer optimal performance, including challenging food products and processing conditions, SunLam adhesives have a significant effect in terms of product resistance and high temperature stability. The latest oxygen barrier adhesive technology also gives the opportunity for lightweighting, reducing cost and complexity, while maintaining overall performance. The SunLam family of lamination adhesives consists of water-based, solvent-free and solvent-based products designed to meet the needs of all the major flexible packaging applications globally.