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Sun Chemical, DIC Launch SunLam Lamination Adhesives



Published May 14, 2014
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During Interpack 2014, Sun Chemical and its parent company, DIC, introduced its new SunLam lamination adhesives range.

The SunLam family of performance lamination adhesives was initially developed by DIC for the demanding Asian market, to offer optimal performance, even with challenging food products and processing conditions.

“Brand owners are looking for flexible packaging solutions that can replace some of the historic rigid packaging applications,” said Colin Smith, European product manager, Sun Chemical, “while retaining or improving upon current barrier properties of the structure which has, in most cases, a direct effect on the shelf life and integrity of the product. SunLam adhesives do just that. They can have a significant effect in terms of product resistance and high temperature stability. The latest oxygen barrier adhesive technology also gives the opportunity for lightweighting, reducing cost & complexity, while maintaining overall performance.


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