Techblick is introducing its article series, which will highlight various innovation trends in the diverse area of printed, hybrid, in-mold, and 3D electronics. Techblick’s goal is to demonstrate progress and state-of-the-art on various fronts ranging from R2R on-paper printing to thin ICs to conductive inks to stretchable substrates to in-mold electronics and beyond.

Here is a sample of articles:
• Towards thin and flexible logic
• 32-bit natively flexible ARM processor
• Electrohydrodynamic printing (EHD): breaking the limits of inkjet
• Silver nanoparticle inks: low-T curing, IME-compatibility, and transparent heating applications
• Print-on-Paper: Towards R2R printing of multi-chip multi-layer circuits
• Printed hybrid Arduino-type circuits

These articles showcase works from S&S, Enjet, CPI, Parsons, ARM, American Semiconductor, Agfa, Nanogate, and CEA-LETI. In the subsequent articles, we will cover developments at Signify, Jabil, Jones Healthcare Packaging, Swarovski, Wuerth, Ntrium, Sunew, XTPL, Identiv, Brilliant Matters, Philips 66, Alpha Assembly, GE Research, ACI, Panasonic, Safi-Tech, DuPont Teijin, VSParticle, Meta, NovaCentrix, Applied Materials, HP, Nano Ops, Brewer Science, e2ip, PolyIC, Kundisch, FIAT, Geely, and many others.

You can learn the details of all these innovations by becoming a TechBlick member. By becoming a TechBlick Annual Pass, holder you will benefit from all-year-around learning, training, and networking on emerging technologies. Members will have access, for 12 months, to participate in all Techblick LIVE in-person virtual events, catch up with content using its library of on-demand content, and learn from industry experts using Techblick’s portfolio of masterclasses.