Xaar Wins ‘Innovation of the Year’ at 3D Printing Industry Awards

Xaar plc was awarded ‘Innovation of the Year’ at the 3D Printing Industry Awards 2018. Xaar received the honor for its High Laydown Technology for Material Jetting.

Voted for by readers of 3D Printing Industry, the awards recognize individuals and enterprises leading the additive manufacturing world. They were announced at a black-tie, gala event at Nuffield Hall in London on May 17. Xaar was among representatives from more than 60 companies.

By ensuring that all the printhead nozzles fire at the same time, High Laydown (HL) Technology from Xaar offers massively increased material deposition rates compared to standard three-cycle printing operation. This enhances speed and productivity and allows for greater volume production speed in 3D Printing. Additionally, HL Technology allows for printing high viscosity fluids enabling the creation of 3D printed parts with higher part properties than other technologies.

“As 3D Printing develops to take its place as a mainstream manufacturing process it is clear that certain challenges need to be overcome, and we are very proud that Xaar’s High Laydown Technology addresses two of the main challenges – namely the speed of part manufacture and the properties of parts produced,” said Neil Hopkinson, director of 3D Printing at Xaar, and the inventor of High-Speed Sintering.

“To win the award for ‘Innovation of the Year’ is especially pleasing as this normally goes to a specific 3D Printing process, whereas in this case it goes to an enabling platform from which multiple, highly differentiated, processes can be created; the fact that this subtlety was appreciated by the 3D Printing Industry readership speaks volumes for the insight and credibility of this community,” he added.

The 3D Printing Industry Awards are an annual gathering of the leaders in additive manufacturing. This year voting was up 35% on 2017, and the shortlists spanned all areas of the 3D Printing ecosystem – from medical, aerospace, and creative applications to 3D scanning, software and materials.