Flexible Electronics News

Virtual MSEC 2020 to Spotlight MEMS, Sensor Innovations for Medical, Smart Cities, More

The event will focus on solving technology challenges in vital areas such as health and safety.

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By: Anthony Locicero

Copy editor, New York Post

Staged for the first time in virtual format, MEMS and Sensors Executive Conference (MSEC 2020) will gather industry visionaries and experts Oct. 6-15 for the latest trends and innovations in sensorization for growth markets including medical, entertainment, augmented and virtual reality, the environment, food production, smart cities, ultrasonics and wearables. 

 

Themed The Next Wave of Sensorization: Solving our Shared Challenges, the event will focus on solving technology challenges in vital areas such as health and safety while fueling the experience economy with advances in virtual and augmented reality. 

 

Components, software, and systems critical to MEMS and sensors innovations will come into sharp focus at the conference. 

 

Registration is open.  
 

MSEC Keynotes 

 

Michael Tschanz disney headshot MSEC 2020
Michael Tschanz, director, Engineering Technology and Analysis

Disney’s extensive use of sensors including for rides, animatronics and sensorization of the world’s largest micro transportation system

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Jens Fabrowsky bosch headshot MSEC 2020
Jens Fabrowsky, executive VP, Automotive Electronics

MEMS market opportunities and technology challenges over the next 10 years 

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Dale Zimmerman ms Hololens headshot Aug 2020
Dale Zimmerman, director for Photonics Devices

MEMS-enabled display for Hololens augmented reality, including applications and market progress

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MSEC 2020 will also feature sessions on key industry topics including the following: 

  • MedTech Considerations for Resolving the Trouble with Innovative Sensing Applications – Ian Chen, executive director for Medical New Business Development, Maxim Integrated;
  • Opportunities in Biotech and Related Markets Due to COVID-19  Ross Bundy, co-founder, Cardea;
  • MEMS Tug-of-war: COVID-19 vs Emerging Trends – Dimitrios Damianos, technology and market analyst for Imaging and MEMS, Yole Développement;
  • A Wearable Social Distancing Solution Based on Ultrasonic Time-of-Flight Sensors – David Horsley, co-founder, TDK-Chirp Microsystems;
  • tinyML: Massive Opportunity When Machine Intelligence Meets the Real World of Billions of Sensors – Evgeni Gousev, senior director, Qualcomm AI Research;
  • AI for Ultrasound Medical Imaging – Janusz Bryzek, executive chairman and CTO, eXo Systems;
  • Future Mobility Enabled by Sensorization – Andreas Breitner, partner, McKinsey & Company

 

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