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Five-day exhibition took place at the IndiaExpo Centre in Greater Noida.
March 4, 2019
By: Anthony Locicero
Copy editor, New York Post
At the first year of IndiaPlast 2019, a five-day exhibition held at the IndiaExpo Centre in Greater Noida, Uflex exhibited products and solutions from its 7 businesses. ENGINEERING: Uflex presented its Extrusion Coating & Lamination Machine ‘EX LAM 400’. EX LAM 400 was designed with a line speed of 400 meters per minute. Also on display was the CI Flexo model ‘Elisa’ designed for maximum operating speed of 400 mpm with high automation level in the form of sleeves and anilox removal system. The solventless Laminator Machine ‘Super-S-1300’ has added features of metalized structures up to a speed of 300mpm, whereas all other structures can be run up to a speed of 450mpm. The machine offers a microprocessor-based thermo-regulation system to maintain an optimum temperature of steel rollers. Its unwinder, rewinder, coating, lamination and metering are all controlled by digital drive and motors. FILMS: F—PRP, a 12 Micron BOPET film is designed to meet the critical needs of bulk packaging. It is ideal to use for low density, high volume packaging like large bags of atta, sugar or rice packaging. Similarly, in ready-to-eat food packaging, FTFP a thermoforming film with 15 microns, 23 microns and 36 microns, was developed for semi-rigid packaging suitable for takeaway food items like trays. This product could be used for replacing OPA film where OTR barrier is not important and modified version of F—TFP is available with improved OTR barrier property. Whereas F-FTC, the fast to tear film, overcomes the challenge of tearability in multi-layer packaging which makes the films easily tearable in both directions, enabling consumer ease of accessing the product. PETG Resin, an amorphous polymer that does not crystallize, making it an excellent replacement for transparent polymer offering high-performance properties including transparency, clarity, gloss, glaze and printability in applications, was introduced. In the BOPP segment, two variants of ultra-high barrier film were introduced: Ultra High Oxygen Barrier Metallized BOPP film ‘B-TUO-M’ and Ultra High Barrier and High Seal Strength Metallized BOPP film ‘B-TUH-M’. B-TUO-M has outstanding barriers with less than 10 oxygen transmitting rate and sealing functionalities with excellent metal bond strength and metal cracking resistance; and superlative substrate for extrusion lamination; whereas B-TUH-M has outstanding barriers with less than 15 OTR and high seal strength with an excellent hermetic seal; better metal bond strength and nitrogen flushing capabilities. Lastly, Ultra High Barrier with robust seal performance and high metal bond Metallized CPP film ‘C-CLM’ addresses the challenge of sustainable extrusion bond, barrier and seal performance faced by Flexible Packaging industries by replacing three layers with two thereby enabling advantages of a lesser carbon footprint. CYLINDER: Uflex launched new metallic dies wherein the dies produced by the latest CNC Die manufacturing lines are in the form of both metallic plates and rollers, which also have an embossed 3D image engraved on it. The die plates can be produced on flatbed system and can also make rotary dies. This image gets superimposed by means of mechanical pressure or temperature on the printed substrate. The product portfolio also included gravure printing cylinders for glitter printing comprising of very high GSM and very low GSM coating cylinders facilitating embossing for paper, foil, leather, etc. The latest Flexo Printing Plates ensure high-resolution optics up to 4,000 ppi, screens up to 300lpi and 1-99% dots making the output compatible with offset and gravure quality and consistency. At the booth, it also showcased laser engraved elastomer plates. CHEMICAL: The business featured different solutions for flexible packaging and offset applications. Chemicals unveiled Universal Solvent Free Adhesive 777 A/C, which offers excellent performance on various substrates including plastics. This adhesive has exceptional compatibility with NC-PU inks when mixed in the ratio of 1:1.
Next was a sheetfed UV ink, suitable for commercial and non-food packaging applications and the newly developed environmentally friendly high-speed water-based ink. Another Mono component solvent-less adhesive OC512 which is designed for laminating film to a printed and unprinted board and paper was on the shelf too. ASEPTO: The Aseptic Liquid Packaging Business from Uflex showcased innovation in aesthetics of aseptic liquid packaging through holographic transformation. HOLOGRAPHY: The business presented an assortment of anti-counterfeiting products. Also on display were labels with registered lens technology printed with its new orthotec machine and ones with screen effect and customized holographic cartons combining different holographic patterns to form hybrid designs that offer distinctive package appearance.
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