Toyochem to Feature Conductive and Low-Dielectric Materials at JPCA 2016

Toyochem Co., Ltd., a wholly-owned subsidiary of the Toyo Ink Group, will be participating in JPCA Show 2016, or the 46th International Electronic Circuits Exhibition. The show will run from June 1-3 at the Tokyo Big Sight in Tokyo, Japan.
 
Foreseeing future demand, Toyochem, at this year’s JPCA, will spotlight its latest electronics-related materials based on Toyo Ink Group’s materials and processing technologies and propose solutions to meet the electronic engineering needs of its customers and end-users.
 
Visitors to the Toyochem booth 2E-08 can expect the LIOELM TSS series of electromagnetic shielding films, which are specially designed to meet strict shielding demands. The TSS200 series of shielding films is suitable for use on rigid-flex boards due to its superior gap-fill properties, and also exhibits excellent adhesive on a wide range of gold-plated substrates for flexible printed circuits. The TSS300 type is ideal for customers who require thin-type films with stable shielding results.
 
Component engineers looking for conductive sheets that ensure constantly high conductivity can find out more about Toyochem’s LIOELM TSC200 series of electrically conductive adhesive sheets. These sheets boast high resistance to solder reflow heat and embeddability, thanks to the conductive filler dispersed in a heat-resistant urethane adhesive resin developed by the company.
 
Toyochem’s LIOELM TCL500 / TSU™500 series of low dielectric materials will be highlighted at the booth. By using the company’s original low-dielectric resin, this material reduces transmission losses during high-speed transmissions. It also contributes to the widening of circuit interconnect lines and the narrowing of the distance between lines, resulting in greater freedom in integrated circuit design.
 
Toyochem will also spotlight its LIOELM LE series of high heat resistant, low tack, single-sided adhesive tapes. New to this year’s lineup are the LIOELM LE951, LE957L and LE959K heat-resistant protective films, which help to keep the adhesive strength of pressure-sensitive adhesives at a low level even after heat is applied. In addition, LIOELM LE831P-50BK high heat-resistant adhesive tapes for film splicing, LIOELM LE552 low-tack polyurethane-based protective tapes and prototypes of its heat-resistant, repositionable polyimide adhesive tapes are the latest series to hit the market.