Tageos Makes Its Debut at Labelexpo Americas 2024

Underlining its increasing commitment and growth in the Americas market, Tageos makes its debut at the Labelexpo Americas in Chicago, USA, showcasing its latest new products: the ARC Spec C2 certified RAIN RFID inlay EOS-271 U9 for retail applications and two other new HF/NFC inlays; the EOS-970 MIFARE UL C for public transport and ticketing and the versatile EOS-919 NTAG213.

The importance of the American market to Tageos and its customers is also reflected in an increased regional presence, including the company’s first appearance at Labelexpo Americas.

For the French RFID leader, the event is also the venue for product launches that complement its portfolio of innovative, market-leading RAIN RFID (UHF), HF / NFC and sensor inlays and tags:

• EOS-271 U9: Versatile, handy and ARC Spec C2 certified

The EOS-271 U9 inlay complements Tageos’ innovative, retail-optimized and fully ARC-certified inlays and tags. Based on advanced antenna design and latest generation IC technology, the new RAIN RFID product combines handy dimensions with outstanding performance, especially on cardboard, plastic and rubber.

The EOS-271 U9 measures 46 mm x 9 mm (antenna size) and complies with ARC specification C2, making it a highly versatile solution for many item-level applications in non-food retail (cosmetics, DIY & sporting goods, toys) and supply chain management.

The new product is based on NXP’s UCODE 9 RAIN RFID chip. Equipped with 96-bit EPC memory, the IC offers a 96-bit EPC; a kill password; a permalock function for EPC and kill password, self-adjusting impedance and memory integrity safeguards. It is suitable for solutions such as high-speed inventory counting, loss prevention with frictionless self-checkout, and embedded tagging with seamless product return.

• EOS-970 MIFARE UL C: Ideal choice for public transport and ticketing

The company is entering market segments that have not yet been a priority: public transportation and event ticketing. Embedded in smart tickets or smart cards, the EOS-970 MIFAREUL C offers outstanding and highly reliable performance. With a proven IC that is ideally supported by the existing infrastructure and an antenna design that combines the best features of market-leading solutions, the HF/NFC inlay is suitable for a wide range of applications. These include public transport ticketing, hospitality and leisure, and loyalty applications.

The EOS-970 MIFARE UL C is equipped with a proven and intensively used member of NXP’s MIFARE product family, the MIFARE Ultralight C (MF0ICU2) IC from NXP. It is specifically designed for use in contactless smart tickets or smart cards in combination with Proximity Coupling Devices (PCD).

• EOS-919 NTAG213: A combination of performance and compact design

Another new product is the EOS-919 NTAG213. With its compact design, the HF/NFC inlay fits perfectly in a wide range of applications that require a small footprint. The EOS-919 NTAG213 enables state-of-the-art solutions for consumer engagement and customer experience, reliable product authentication and diversion protection and many other smart product and packaging applications. The new inlay utilizes the NXP’s NTAG213 IC that comes with 144-bytes user memory.

“With our presence at Labelexpo Americas, Tageos is once again demonstrating that we don’t do things by halves: our support, our presence and our visibility in the important American market, as well as the development of our latest RFID inlays and tags that are precisely tailored to the needs of our customers and the market,” said Jeremy Wade, VP sales and business development Americas at Tageos.