SEMI Commends U.S. CHIPS Act Incentives for Amkor Technology

SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, applauded the US Department of Commerce’s announcement of a preliminary memorandum of terms for an award under the CHIPS and Science Act to support Amkor Technology construction of a facility in Peoria, Arizona for the advanced packaging of semiconductors.

The proposed direct funding of up to $400 million would bolster Amkor’s investment of approximately $2 billion and 2,000 jobs in the Arizona greenfield project, which will support end-to-end production of leading-edge chips for applications in high-performance computing, artificial intelligence, communications, automotive and other markets.

“SEMI has advocated for incentives to support the entire advanced chipmaking ecosystem, and we applaud the U.S. Department of Commerce for this latest investment to strengthen the vital packaging phase,” said Joe Stockunas, president of SEMI Americas. “This proposed CHIPS Act funding for SEMI member Amkor would support the fast-growing semiconductor ecosystem in Arizona with domestic advanced packaging and test capabilities that are essential for chip innovation.”