Samsung Showcases Semiconductor Solutions at CES 2019

At this year’s CES, Samsung Electronics introduced its vision for the future of Connected Living and exhibited its most up-to-date solutions at the Las Vegas Convention Center.
 
This year, three memory products received CES 2019 Innovation Awards. The 2019 CES innovation award-winning products included Samsung 256GB 3DS DDR4 RDIMM, Samsung 3.84TB NVMe Z-SSD, DDR4 RDIMM and Samsung 512GB Universal Flash Storage (eUFS).
 
Samsung 256GB 3DS DDR4 RDIMM is the industry’s fastest DDR4 and highest density memory module for next-generation enterprise server platforms. Samsung 512GB Universal Flash Storage is the industry’s first 512-gigabyte embedded Universal Flash Storage (eUFS), for automotive A/V systems and next-gen flagship mobile devices.
 
Samsung 3.84TB NVMe Z-SSD SZ1733 offers a new level of storage for supercomputing targeted for AI analysis, big data and IoT applications, using the new Z-NAND chips that provide 10 times higher cell read performance than 3-bit V-NAND chips.
 
Samsung’s automotive solution featured key components and technologies for an in-vehicle infotainment, telematics and advanced driving assistance system (ADAS), including the latest Exynos Auto V9, Samsung’s first automotive dedicated system-on chip for the next generation IVI (In-Vehicle Infotainment) system.
 
Samsung also showcased the Exynos Auto T, a telematics solution that allows safe driving experience through integrated use of telecommunications and informatics technologies. Samsung also demonstrated ADAS solutions’ visual perception capabilities. The demo showed the ADAS system recognizing and detecting objects such as cars, pedestrians and traffic signs.
 
Samsung showcased its advanced image sensor technology, which is one of the key elements for enabling a new kind of driving experience. Samsung ISOCELL Auto image sensor provides superb object recognition and sensing in diverse and complicated lighting environments when driving.

Source: Samsung