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Topics include flexible hybrid electronics, precision additive and R2R printing, printed and R2R photovoltaics, and hybrid CMOS SWIR sensors.
February 23, 2021
By: Anthony Locicero
Copy editor, New York Post
TechBlick wrote an article that highlights promising innovation and market trends in printed, hybrid, and in-mold electronics.
The topics discussed include flexible hybrid electronics, precision additive and R2R printing, printed and R2R photovoltaics, and hybrid CMOS SWIR sensors.
All trends highlighted in this article will be discussed by the key players in the field in TechBlick’s upcoming interactive LIVE online conferences and exhibitions taking place on March 10-11, 2021 and May 11-12, 2021
With a single Annual Pass you can access all future LIVE (online) conferences and exhibitions, masterclasses, a library of on-demand content, and community networking opportunities.
To read this article in full and to find out more about TechBlick’s year-round virtual platform click here.
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