NXP Introduces World’s Thinnest Contactless Chip Module

NXP Semiconductors N.V. announced its new, ultra-thin contactless chip module that transforms how passport and identity cards are designed. Measuring just 200 μm thick ­– roughly four times the thickness of an average human hair – the MOB10 is 20% thinner than its predecessor and is suited for use in ultra-thin inlays for passport data pages and identity cards.
 
The MOB10 is the thinnest contactless module available in high volumes today and supports polycarbonate technology, along with new security and durability features. Additionally, the MOB10 is the first ultra-thin platform designed to be compatible with existing production lines so manufacturers can add it without retooling.
 
The new ultra-thin MOB10 is designed to combat electronic document fraud by enabling slimmer and more secure eDatapages, eCovers and ID card inlays that are harder to forge or modify.
 
The ultra-thin profile of 200 μm makes it possible to accommodate new security features and still include the secure microcontroller and its antenna without adding bulk to passports, national eID cards, eHealth cards, citizenship cards, resident cards, driver licenses and smart cards.
 
For passports, the MOB10 now allows the IC to be moved from the cover of the passport booklet to the personal data page within the inside of the passport.
 
“We are experiencing increased demand for slimmer solutions that can meet the future embedding requirements needed to produce thinner, and more cost-effective identity documents,” said Sebastien Clamagirand, GM of the secure identification business line at NXP.