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The initial phase of the joint project will focus on the development of a full digital cockpit solution.
December 16, 2021
By: DAVID SAVASTANO
Contributing Editor, Coatings World and Ink World
NXP Semiconductors N.V. has announced a strategic partnership with Foxconn Industrial Internet Ltd., a subsidy company of Foxconn group to transform the car into the ultimate edge device. NXP will provide FII with its comprehensive portfolio of automotive technologies. The initial phase of the joint project will focus on the development of a full digital cockpit solution, based on the NXP i.MX 8 QuadMax. The platform will include digital clusters, and a head-up display (HUD) system, which will enable leading global automotive OEMs and Tier Ones to deliver vivid in-vehicle experiences for their customers. The digital cockpit solution is expected to start mass production in 2023. The companies aim to expand the relationship into UWB-based secure car access, and safe automated driving, augmented by NXP’s leading radar solutions. “FII is committed to providing clients with an automated, connected platform and big da-ta-based technology, services and solutions, in order to create application platforms across cloud computing, mobile devices, Internet of Things (IoT), artificial intelligence (AI), smart networks, robotics and automation, among other industries,” said Brand Cheng, CEO at Foxconn Industrial Internet Co. Ltd. “We are pleased to join forces with NXP to strengthen the development blueprint of FII and drive innovation for connected cars by leveraging NXP’s leading automotive technology.”
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