MOSIS Collaborates with imec, Tyndall and ePIXfab

MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, has teamed up with ePIXfab, the European Silicon Photonics support center providing low-cost prototyping services for photonic ICs. The partnership gives MOSIS’ customers access to imec’s state-of-the-art fully integrated silicon photonics processes and Tyndall’s advanced silicon photonics packaging technology.

Imec’s silicon photonics platform enables cost-effective R&D of silicon photonic ICs for high-performance optical transceivers (25Gb/s and beyond) for telecom, datacom, and optical sensing for life science applications. A comprehensive design kit to access imec technologies will be provided.

Moreover, the Tyndall National Institute, being a partner of ePIXfab, offers the ability to provide packaged silicon photonics devices. This includes the design and fabrication of custom photonic packages, fiber coupling (single and arrays) and electrical interconnects.

“Imec’s Silicon Photonics platform provides robust performance, and solutions to integrated photonics products. Companies can benefit from imec silicon photonics capability through established standard cells, or explore the functionality of their own designs in MultiProject Wafer runs,” stated Philippe Absil, program director at imec.

“With this collaboration MOSIS will offer its first access to a mature Silicon Photonics infrastructure, with the option for follow on production” added Wes Hansford, MOSIS Director.

The first ePIXfab-Europractice run for passive silicon photonics ICs is open for registration from June 2013 with design deadline Sept. 9, 2013. MOSIS customers can register for this run and obtain the design kit via MOSIS in June 2013.