International Industry for Printed Electronics Meets at LOPEC 2014

A key factor for the success of printed electronics is networking among companies along the entire value chain. LOPEC in Munich, which has prominent international exhibitors and conference speakers in the sectors for materials, systems, production and applications, is an important platform for networking.

Among other things, 3D printing in conjunction with printed electronics is one of the main topics of the conference program. LOPEC, the International Trade Fair and Conference for Printed Electronics, takes place in Munich from May 26-28.

The market for printed electronics is on the move. Increasing demands to cut costs, reduce weight and increase flexibility favor the use of printed electronics, particularly in consumer electronics. However, the automotive industry also relies on the various possibilities that this technology has to offer, for example in the design of automotive interiors and lighting. Dr. Stephan Kirchmeyer, OE-A chairman and head of the Business Unit Functional Coatings Conductive Polymers Division at Heraeus Precious Metals, emphasizes its great significance to the industry: “LOPEC changes at the same pace as the industry and is developing from a technology platform to the most important marketplace for printed electronics,” Dr. Kirchmeyer said.

More than 80 international companies from 12 countries have already registered for the fair. They include 3D Micromac, Agfa-Gevaert, Kroenert, Merck, PolyIC and Thin Film Electronics. Several research organizations such as Acreo-Swedish ICT, Georgia Tech Center for Organic Photonics and Electronics, the Holst Centre and a number of Fraunhofer Institutes are also participating. First-time exhibitors include Cambridge Display Technology, Megtec Systems, Optomec, Varta Microbattery and a number of other companies.

During the fair, live demonstrations of how a battery tester is produced will depict the entire value chain, from raw material suppliers to the finished product. Bosch Rexroth, Coatema, DuPont MicroCircuitMaterials, Novacentrix, Fujifilm Dimatix, Thieme, Felix Schoeller Group and Heraeus Precious Metals have already confirmed that they are participating in the demonstration line.

For the first time ever, the LOPEC Forum will feature 30-minute introductory lectures with basic information about everything related to printed electronics. In a subsequent tour of the fair, various topics such as machines or final applications will be explained using concrete examples. According to Anja Schneider, Exhibition Director of LOPEC, “More and more manufacturers of end products are attending this event. We hope that these lectures will give them a sound information foundation for concrete business discussions.”

The conference from May 26-28 is an important gathering between research, development and industry representatives at the international level. It is the largest and most comprehensive conference for printed electronics and is instrumental for the global exchange of know-how. Among other things, the plenary sessions will feature a presentation by Hitoshi Abe, president of Japera (Japan Advanced Printed Electronics Technology Research Association), about the development of printed electronics in Japan. In his lecture on “Flex Nodes for Connected People,” Jaap Lombaers from the Holst Centre in the Netherlands will explain how combining organic and classic silicon electronics makes intelligent clothing possible. It can be used in medical technology as well as for sports and recreation.

The combination of printed electronics and 3D printing is a separate focal point at the technical conference. Among other things, speakers will include representatives of Stratasys and MakerBot Industries in the U.S. and the Vienna University of Technology. Other presentations will deal with topics such as OLEDs, hybrid systems, the use of printed electronics in the pharmaceuticals sector and flexible solar cells.