GSI Group Announces $7 Million Order and $10 Million Letter of Intent for Advanced Laser Fuse M550 Wafer Repair Processing Systems

GSI Group Inc., a supplier of precision technology and semiconductor systems, today announced that an existing Taiwanese customer, has issued a $7 million order and an additional $10 million letter of intent for multiple M550 IR advanced laser wafer repair processing systems. Six of these systems are expected to be delivered in the fourth quarter of 2007. The remaining systems are expected to be delivered in the first half of 2008.

The M550 is GSI’s newest generation Wafer Repair platform offering high throughput, accuracy and yield for today’s high volume automated semiconductor environments.

Nino Federico, Vice President and General Manager of GSI’s Semiconductor Systems Division said, “We are pleased that our systems were selected for this large follow-on order and letter of
intent. GSI’s M550 wafer repair systems provide the throughput, accuracy and yield to enable the largest memory device producers in the world to perform their mission critical work.”