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Award is presented by SEMI and Semiconductor Digest at Semicon West.
July 12, 2024
By: DAVID SAVASTANO
Contributing Editor, Coatings World and Ink World
The EVG®880 LayerRelease system from EV Group (EVG) has won the 2024 Best of West award, SEMI and Semiconductor Digest announced at SEMICON West 2024 at the Moscone Center in San Francisco.
Presented by SEMI and Semiconductor Digest each year, the Best of West award recognizes innovative new products or services that are significantly advancing the electronics manufacturing supply chain or a particular manufacturing capability.
The EVG 880 LayerRelease system is the first high volume manufacturing (HVM) equipment platform incorporating EVG’s innovative LayerRelease technology. It enables nanometer-precision release of bonded, deposited or grown layers from silicon carrier substrates using an IR laser coupled with specially formulated inorganic release materials.
As a result, it eliminates the need for glass carriers—enabling ultra-thin chiplet stacking for advanced packaging, as well as ultra-thin 3D layer stacking for front-end processing, including advanced logic, memory and power device formation, to support future 3D integration roadmaps.
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