Flexible Electronics News

DuPont to Exhibit at SID 2008

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By: DAVID SAVASTANO

Contributing Editor, Coatings World and Ink World

The SID International Symposium, Seminar and Exhibition, now in its 46th year, is the premier international gathering of scientists, engineers, manufacturers and users in the electronic-display industry. DuPont will exhibit (West Hall, Booth 119) ground-breaking process technology, proprietary materials and films across three display technologies: LCDs, OLEDs and PDPs.

For the LCD industry, DuPont offers Optilon™ Thermal Color Filter System a dry and maskless color filter manufacturing system that employs direct laser writing, uses 50% less cleanroom space and reduces environmental impact through the elimination of solvent emission and liquid waste; DuPont™ Optilon™ advanced composite reflectors with significantly enhanced light management properties and DuPont™ Vertak™ bonding technology and adhesive system that dramatically improve the outdoor readability and durability of displays.

DuPont brings a cost-efficient solution to the OLED industry with high performance materials and solution printing process technology that reduce material usage, capital and operating costs for AMOLEDs.

For PDP manufacturers, DuPont™ Fodel® 8th Generation (8G) photoimageable thick-film pastes deliver higher resolution and lower manufacturing costs while DuPont™ Transfer Materials Technology (TMT) – a new dry-film based metallization process – enables higher resolution patterning, increased electrode design freedom and lower cost of ownership while eliminating processing chemicals and reducing overall energy consumption.

DuPont Teijin Films is exhibiting industry-leading PET and PEN polyester films and a wide range of stabilized and planarized films for flexible displays and printable electronics.

By combining proprietary materials and innovative process technology, DuPont puts science to work in displays creating innovative and sustainable solutions designed to overcome some of the industry’s greatest challenges.

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