CPI Demonstrates Ultra-Flexible OTFT Device Array

The Centre for Process Innovation (CPI) has developed novel backplane fabrication processes to allow the bending of organic thin film transistors (OTFT) arrays to small radii (1 mm) without a significant reduction in device performance. The work undertaken demonstrates progress towards optimum organic semiconductor (OSC)/OTFT processing and performance to enable their integration into ultra-flexible active matrix organic light emitting diode AMOLED backplanes.

In order to achieve the tight bend radius, the multiple interfaces present in the device stack were optimised to allow good adhesion under the strains experienced in the bending test.

This demonstration of bend resistance in high performance OTFT devices is part of ongoing work to integrate these materials into active matrix backplanes for AMOLED. It is expected that within 2014 the first plastic based display demonstrators will be completed using OTFT in project ROBOLED, which has received funding through the Technology Strategy Board.