Conclusion of Agreement to Transfer Shares of NEC Toppan Circuit Solutions, Inc.

Toppan Printing Co., Ltd., NEC Corporation and Kyocera Corporation have entered into a share transfer agreement to transfer to Kyocera all shares of NEC Toppan Circuit Solutions, Inc. (TNCSi), a Toppan Printing subsidiary that manufactures printed wiring boards. Toppan Printing Co., Ltd. had owned 55% of the shares, and NEC Corporation the remaining 45%.

Toppan Printing conducts semiconductor-related business including the manufacture of photomasks, in which the company enjoys a large global market share, and package substrates. This reorganization will enable Toppan to concentrate management resources on the FC-BGA substrate market, which is considered to have significant growth potential due to factors such as the miniaturization of semiconductors.

Toppan will pursue further expansion of its semiconductor-related business by providing customers with a comprehensive service from photomasks used in front-end processes of semiconductor manufacture to package substrates for back-end processes.