Brewer Science Presents Optics Integration Solutions at SPIE Photonics West

Brewer Science, Inc. presents solutions to optical integration challenges at the SPIE Photonics West Exhibition in San Francisco, California.

Transition to 3D wafer-scale integration is a challenge faced in new photonic integration projects The transition from traditional separate manufacturing and packaging processes to3D wafer-scale integration remains a challenge faced in any photonic integration project.

Augmented, virtual, and mixed reality bring their own unique set of optic integration challenges, including the need for materials with deep submicron processing capabilities and minimal defectivity.

Advanced CMOS processing and high-quality materials are critical for next-generation materials. Scaling wafers to smaller sizes, while increasing functionality, places an emphasis on material selection and leading-edge CMOS node capabilities.

Having shared expertise in advanced lithography and providing next-generation packaging solutions, Brewer Science leverages an extensive marriage of capabilities that encourages scalability and economical integration.

With four decades of extensive experience serving diverse markets and customers, Brewer Science provides customers with cohesive and seamless optics integration, including materials in some of the most innovative spaces:
• Lithography enhancement materials
• Next-generation packaging solutions
• Permanent materials, including high and low refractive index materials, protective coatings (including anti-scratch coatings), transparent permanent adhesives and PermaSOL permanent wafer bonding material.