Brewer Science Introduces New-Generation Debonder

Brewer Science is introducing a new and improved thermal slide debonder that enables high-temperature slide-off of thinned compound semiconductor substrates in a research and development or low-volume production environment. The Brewer Science Cee 1300CSX thermal slide debonder features computerized process control and delivers exceptional accuracy, interface capabilities, and process flexibility.

“The Cee 1300CSX debonder is designed to meet the challenges of handling thinned compound semiconductor substrates,” said Wayne Farrar, director of the Equipment Business Group at Brewer Science. “We have separated many types of exotic wafers thinned to a thickness of less than 50 µm with excellent results.”