BOBST to Offer Look at Future at PACK EXPO International

BOBST will showcase its latest machinery and peripherals at the returning PACK EXPO International.

After a four-year hiatus, the packaging and processing industries will once again gather at McCormick Place in Chicago, IL. The four-day trade show will run between October 23-26.

The most comprehensive global event of its kind, PACK EXPO International enables businesses to explore packaging solutions from creation to delivery, participate in educational sessions and networking opportunities with more than 40 vertical industry sectors.

“We continue to create solutions which match market demands for faster delivery times, and more sustainable operations,” said Emilio Corti, market director at BOBST. “The needs of converters are at the heart of everything we do, and an investment in BOBST machines not only promises pure reliability and performance, but it also affords significant competitive advantages.

“As consumers grow their knowledge about sustainability, investment in proven solutions from the BOBST portfolio activate the ability to effectively communicate packaging stories.”

Two of the newest innovations include NOVAFOLD, launched in January of this year and designed to address the real-world needs of the industry, and MASTERLINE DRO, a new rotary die-cutting solution. 

Engineered to boost capacity and end-product quality, NOVAFOLD 50, 80 and 100 folder-gluer models can produce a wide variety of box styles, across a range of substrates, and at speeds of up to 300m per minute. BOBST MASTERLINE DRO is capable of productivity reaching an output of more than 40 million square meters per year.