BASF Showcases Modern Packaging Concepts at interpack 2026

BASF and its European distribution organization, BTC Europe, will present its broad portfolio for the packaging industry at the international trade fair interpack, hall 10, booth A 44. 

The focus of BASF’s booth will be on material solutions, product innovations, and recycling‑friendly systems for the packaging industry. 

BASF will showcase applications and concepts in the following areas:

• Polyamide packaging with Ultramid Ccycled for food packaging and other sensitive applications, as well as the newest product innovation Ultramid H, the first thermoplastic polyamide with high water permeability.
• Adhesives that support packaging recycling within existing infrastructures and processes: water‑based Epotal laminating adhesives for easy separation of materials in PET‑based multilayer packaging and for producing safe recyclates from mono‑material films without harmful substances such as primary aromatic amines (PAA); label adhesives that can be easily removed from PET and glass bottles (acrylate hot‑melt acResin) as well as from paper and cardboard packaging (water‑based dispersions Acronal RCF).
• Water-based Joncryl resins for printing inks and barrier coatings for innovative and sustainable packaging solutions, which are fully repulpable and compatible with current recycling protocols for paper-based packaging. The use of bio-based, mass-balanced or chemcycled materials further helps to achieve significant CO2 savings.
• The certified home-compostable biopolymer ecovio for a broad range of flexible and rigid packaging: from ultra‑thin biaxially stretched films with excellent optical properties to high-barrier packaging of fast‑moving consumer goods (FMCG) – all suitable for organic or paper recycling.

These solutions are aimed at customers and partners from various industries, such as food, pet food, non‑food, pharmaceuticals, cosmetics, and industrial goods applications.

The world’s leading trade fair for packaging as well as packaging materials and processing technology will take place in Düsseldorf, Germany, from May 7 to 13, 2026.