Applied Nanotech to Exhibit at Nanotech China

Applied Nanotech Holdings, Inc. will showcase some of its key nanotechnology advancements at Nanotech China, which is being held in Shanghai, China from May 27 -29, 2010 at the Shanghai Everbright Convention and Exhibition Center.

At its booth, ANI will focus on its namomaterials, both composites and CarbAl, as well as its conductive ink technologies. ANI has also arranged meetings during its time in China with companies interested in manufacturing products that use ANI’s technology in many different areas.

In addition, Applied Nanotech will exhibit and present at the TechConnect World Nanotech Conference and Expo 2010 being held at the Anaheim, CA. The conference is being held at the Anaheim Convention Center from June 21-24, 2010. Applied Nanotech will give three separate presentations:

• Non-Contact, Printable Metallic Inks for Silicone Solar Cells
• Tin Whisker Mitigation – A Nanotechnology Enable Solution
• Improving CPV Performance and Reliability with a Nano-Engineered Thermal Management Material.