American Semiconductor Announces Process Release for Ultraflex 

American Semiconductor, Inc. (ASI), a U.S.-based leader in advanced substrate manufacturing and microelectronics packaging, announced the release of its Ultraflex Cu-on-Polymer high-density interconnect (HDI) flexible substrate manufacturing process. 

This milestone establishes the first U.S. manufacturing capability for 1µm flexible advanced substrates and enables American Semiconductor to support new customer process development programs and prototype fabrication for next-generation semiconductor applications.

Built on a polyimide-based flexible substrate architecture, Ultraflex supports copper features down to 1 µm, multi-layer HDI structures, fine-pitch vias, and precision interconnect routing for advanced semiconductor packaging. The process combines ultra-high-density interconnect performance with exceptional mechanical flexibility, demonstrating bend durability exceeding 500,000 cycles at a 5 mm radius and operation across temperatures from -55°C to +150°C. 

These capabilities enable compact, lightweight, and highly reliable electronic systems for defense, aerospace, medical, wearable, and next-generation semiconductor applications.

The release of the Ultraflex manufacturing process represents a major step toward strengthening the U.S. advanced electronics supply chain by providing domestic access to a technology that has not previously been available from a U.S. manufacturer. 

Ultraflex advanced substrates are manufactured by American Semiconductor and made in the U.S.A., enabling a rapid transition from process development to prototype and production.

The Ultraflex process release marks a significant milestone in the advanced substrate development program first announced by American Semiconductor on January 6, 2026. 

While platform development continues, the released process is now available to accelerate customer innovation through new product development and prototype builds.