2019FLEX Japan, MEMS & Sensors Forum Spotlights IoT, Smart Transportation, MedTech

 

Hosted by FlexTech, a SEMI Strategic Association Partner, the leading FHE exhibition and conference will highlight the latest trends in IoT, Smart Transportation and MedTech in the Japan region. Registration is now open.

Assembling experts from Belgium, France, Japan, South Korea, and the United States, the two-day event offers two networking events for innovation, partnership and business opportunities, as well as four technical sessions:

• FHE and Printed Electronics;
• IoT Applications;
• MEMS and Sensors;
• Textiles

2019FLEX Japan and MEMS & Sensors Forum Keynotes

	Dr. Meyya Meyyappan, Chief Scientist for Exploration Technology at NASA’s Ames Research Center will offer insights into the latest printed electronics equipment and application developments.
	Wilfried Bair, VP of Technology at NextFlex, will highlight FHE developments at NextFlex.

2019FLEX Japan will feature presentations from industry thought leaders on Smart Transportation, MedTech and Life Science, and Common Technologies for FHE.

SMART Transportation Yole Développement, IBM Japan, ISORG, Shizuoka University, PNI Sensor, Velodyne LiDAR
MedTeck and Life Science Jenax, Centexbel, Hiroshima City University, Osaka University, Daiwa House
Common Technologies for FHE Fujitsu Advanced Technologies, Kitech, Gunma University, DNP

2019FLEX Japan will also feature tabletop exhibits by FHE, MEMS and sensors manufacturing supply chain players and electronics companies integrating these technologies.

View the program agenda.