2017 iNEMI Roadmap Looks to Future of Electronics Manufacturing

The 2017 Roadmap from the International Electronics Manufacturing Initiative (iNEMI) is now on sale on the iNEMI website. With 28 chapters (the most ever published by iNEMI) and 2,300+ pages, this latest edition of the roadmap provides a comprehensive view of the electronics manufacturing supply chain’s technology needs and challenges over the next 10 years.
 
Seven chapters anticipate the technology needs of key market segments by focusing on the market demands and functionality requirements of the following sectors: automotive, aerospace and defense, consumer and office systems, high-end systems, Internet of Things (IOT), medical, and portable and wireless.
 
The remaining 21 chapters identify technology trends, focusing on the key technology capabilities and developments anticipated and required within the electronics manufacturing supply chain to meet product needs over a 10-year horizon.
 
The 2017 Roadmap features a new chapter on IOT, which highlights the challenges in new market applications. In addition, the Aerospace & Defense, Packaging & Component Substrates, and Test, Inspection & Measurement chapters are once again included.
 
“This is our most ambitious roadmap to date, providing in-depth information about the broadest range of topics that we’ve ever covered,” said Bill Bader, CEO of iNEMI. “It is an important tool for helping manufacturing supply chain companies anticipate the evolution of technologies and growth of markets, so that they can pursue solutions that will have the greatest return. And, in light of the demise of other industry roadmaps, the iNEMI Roadmap is that much more important for keeping abreast of industry trends and needs for the future.”
 
Technology Trends
 
The 2017 iNEMI Roadmap highlights several key technology trends impacting electronic manufacturing and its supply chain, including:
 
• Growing data volume — along with secure and swift transfer, and the ability to analyze it intelligently — will be a key industry focus.
• Security and interoperability of data, devices and users are two immediate “grand challenges” for the industry and its markets.
• Commercialization of services, particularly software-enabled and cloud-based services, will continue to expand.
• Emergence of new computing architectures in the high-end segment to address the complex tasks.
• Deployment of IOT capabilities beyond consumer markets into automotive, medical and industrial applications will drive major changes in global manufacturing and end use.
• Transition from the beginning-of-the-century vision for products completely enabled by printed electronics to products enabled by “flexible hybrid electronics” where traditional low-profile electronic components are integrated with printed components and flexible substrates.
• Autonomous driving technologies are affecting several technologies – such as sensors.
• Growth of perceptual and location aware computing and connectivity will continue the drive for heterogeneous system integration.
• The need to ensure supply chain integrity and efficiency will drive changes in existing business and manufacturing models.
• Increasing product traceability requirements from silicon to end user.
 
The roadmap is a global collaborative effort that involves many individuals who are leading experts in their respective fields and represent many perspectives on the electronics manufacturing supply chain. More than 500 individuals from at least 22 countries, and representing more than 350 corporations, consortia, government agencies and universities came together to create the 2017 Roadmap.
 
The complete roadmap is available on the iNEMI website for $3,500, and individual chapters can be downloaded for $500 each. Special pricing is available for universities, government agencies, research laboratories, associations/consortia, and other non-profits.