hubergroup Launches LED Ink for Food Packaging at METPACK

At this year’s METPACK, hubergroup Print Solutions presented its comprehensive portfolio for metal decoration at hall 1, booth 1B11.

Highlights include two series for food packaging: the conventional offset series TINKREDIBLE MGA, which was recently launched globally, and the NewV tin LED MGA series, which will make its official debut at the exhibition.

A key highlight at METPACK 2026 is the introduction of NewV tin LED MGA, an LED-curing ink series for food packaging designed for three-piece can applications. 

“With NewV tin LED MGA, we are giving metal decorators a reliable, future-proof LED solution that meets the stringent safety requirements of food packaging while delivering excellent printing performance,” said Jan Museler, Product Manager Metal Decoration at hubergroup. “It’s an important step in supporting the industry’s transition to LED-UV technologies.”

NewV tin LED MGA responds directly to the growing industry shift toward LED-UV curing technologies, particularly in sensitive food applications where safety, efficiency, and sustainability are critical. 

The series complies with the requirements of the German Ink Ordinance (GIO), the Swiss Ordinance, and the guidelines of renowned brand manufacturers.

Complementing the TINKREDIBLE and NewV ink systems, hubergroup provides a full suite of varnishes and fountain solution additives, all engineered to work seamlessly together. 

This integrated approach ensures consistent performance, high efficiency in the pressroom, and reliable end-product quality – delivering a complete system from a single source.

“METPACK is the ideal platform to demonstrate how our fully integrated pressroom solutions support metal decorators in meeting evolving market demands,” commented Patrick Hübel, Director Product Management and Technical Marketing Offset at hubergroup. “By combining high-performance products with strong technical service, we enable our customers to achieve consistent quality, greater efficiency, and a smoother transition to future-ready technologies.”