Flexible Electronics News

SEMI Applauds Legislative Solution to Address Gap in US Chips Act

Commends a proposed legislative action by the US government to address the Notice of Funding Opportunity for CHIPS and Science Act.

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By: DAVID SAVASTANO

Contributing Editor, Coatings World and Ink World

SEMI issued the following statement from Joe Stockunas, president of SEMI Americas. Stockunas commends a proposed legislative action by the United States government to address the Notice of Funding Opportunity for CHIPS and Science Act support for the construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the U.S.:

“As a result of the U.S. Department of Commerce’s decision to change course on issuing a third Notice of Funding Opportunity for commercial R&D under the CHIPS and Science Act, the program now faces a funding headwind to fully meet its mandate. The shift was necessitated by legislative actions directing a $3.5 billion investment in secure enclave. We strongly support a legislative solution to bridge this funding gap for the CHIPS Program Office. The Senate Commerce Committee will consider the solution – Section 602 of the Spectrum and National Security Act – this week.”

“As currently written, the proposed legislation would responsibly restore the full funding and enable the Department of Commerce to continue strengthening the domestic supply chain and reprioritize semiconductor commercial R&D projects as initially envisioned by the CHIPS and Science Act. SEMI applauds the vital work underway by the Senate Commerce Committee and looks forward to supporting the passage of the legislation on behalf of SEMI membership.”

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