SEMICON Taiwan 2024 Opens in Taipei

SEMICON Taiwan 2024 opened Sept. 4. at the Taipei Nangang Exibition Center (TaiNEX Hall 2) with industry leaders and visionaries set to take part in this year’s CEO Summit keynote program.

The program culminates in a first-of-its-kind AI Chip Fireside Chat that will bring together key leaders from ASE Group, Google, Samsung, and TSMC to look at AI’s role in propelling the global semiconductor industry to $1 trillion in annual revenue near the end of this decade.

The fireside chat will focus on how AI is driving global economic growth, strategies to address technical challenges and opportunities surrounding chips, and how different industries can accelerate cross-sector collaboration with the semiconductor ecosystem. Panelists include:
• Hamidou Dia, VP of Applied AI Engineering, Google
• Dr. Jung-Bae Lee, corporate president and head of Memory Business, Samsung Electronics
• Dr. Y.J., Mii, EVP and co-COO, TSMC
• Dr. Tien Wu, CEO, ASE Group, will moderate.

CEO Summit keynotes will spotlight the AI revolution as it relates to manufacturing, packaging and testing, memory, and chip design. Presenters include:
• Gary Dickerson, president and CEO Applied Materials
• Dr. Luc Van den hove, president and CEO, imec
• Noam Mizrahi, EVP and corporate CTO, Marvell
• Rani Borkar, corporate VP, Azure Hardware Systems and Infrastructure, Microsoft
• Dr. Lee of Samsung Electronics
• Justin Kim, president, SK Hynix

Themed Breaking Limits: Powering the AI Era, SEMICON Taiwan 2024 will feature an exhibition from Sept. 4-6 with more than 3,700 booths – a record event high – and over 1,100 exhibitors showcasing groundbreaking semiconductor technology innovations and smart applications. As the largest and most influential annual semiconductor event on the Silicon Island, SEMICON Taiwan 2024 is expected to attract 85,000 visitors from 56 countries.