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Four projects are led by UMass-Amherst, UMass-Lowell, American Semiconductor and Binghamton University
March 8, 2017
By: DAVID SAVASTANO
Contributing Editor, Coatings World and Ink World
The field of flexible electronics is very promising, and developing hybrid manufacturing capabilities that include printing and traditional silicon-based electronics is seen as a strong option going forward. With that in mind, NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute was formed in 2015 by the Department of Defense (DoD) and FlexTech Alliance to advance manufacturing of FHE in the US. As part of its mission, NextFlex is issuing project awards for promising...
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