TechBlick Hosts Virtual Screen Printing and In-Mold Structural Electronics Day

TechBlick, a leading provider of conferences and workshops focused on emerging technologies, announced its latest online event in 2023, covering the following important two themes: (1) The Screen Printing Workshop and (2) In-Mold Structural Electronics. For more information, please see TechBlick’s website.

The event will take place on May 12 online and will bring together industry experts, researchers, and users to discuss the latest advancements in screen printing and in-mold Electronics.

Attendees will have the opportunity to learn about the latest innovations and to engage with a panel of experts bringing more than 150 years of industry experience together and representing all the key steps in industrial screen printing and in-mold electronics. There will also be speed networking opportunities with peers and partners globally.

Key activities include:

Screen Printing Panel: This panel brings together world-class experts in screen printing for an interactive and insightful discussion.
The panelists include:
• Ron Hayden from RH Solutions LLC, with a focus on screen printing and auxiliary equipment
• David Eisenbeiss from Kissel + Wolf Group, with a focus on emulsion technology, including the latest laser imaging developments
• Fernando Zicarelli from Fernando’s Consulting (formerly at Asada Mesh), with a focus on mesh technology and tooling
• Erika Rebrosova from Sun Chemical, with a focus on functional ink technology
• Julie Ferrigno from e2ip, focusing on applications for fineline screen printing

Each panelist will provide a seven-minute overview of their expertise, current state-of-the-art technology, and future developments. There will then be interactive Q&A.

InMold Electronics Panel: This panel brings together world-class experts in in-mold electronics. The panelists include:
• Antti Keränen, CTO of Tactotek, focusing on status of IME process and roadblocks to commercialization
• Dirk Pophusen from Covestro, focusing on status, challenges, and open questions for IME substrates [film aspects]
• Marius Nolte from Covestro, focusing on status, challenges, and open questions for IME substrates [resin aspects]
• Rahul Raut from MacDermid, focusing on Ink portfolio challenges and status for complex IME products
• Robert Boks from Panacol-Elosol GmbH, focusing on status and challenges of component attached in IME environment and on 3D shapes
• Hans-Peter Erfurt from Proell GmbH, covering “From Insert Molding to InMold Electronics: Challenges & Opportunities”

There will be other presentations from Sefar, RISE Institute of Technology Sweden, and Suzhou Maxwell Technologies, outlining the state-of-the-art.

A highlight of the day will be the speed networking sessions where you can connect with other peers and partners for five-minute private one-on-one video conversations before being connected to the next participants.

For more information about the Screen Printing Workshop and In-Mold Structural Electronics Workshop, visit www.techblick.com or contact Chris Clare at [email protected].