Flexible Electronics News

Universal Display to Showcase Phosphorescent OLED Advances at SID Display Week 2023

Will highlight RGB PHOLED narrow emission lineshape and first-ever seven-layer printed PHOLED device with comparable performance to VTE.

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By: DAVID SAVASTANO

Contributing Editor, Coatings World and Ink World

Universal Display announced that it will showcase the company’s latest advances in phosphorescent OLED (PHOLED) and organic vapor jet printing (OVJP) at the Society for Information Display (SID) Display Week 2023 International Symposium, Seminar and Exhibition being held from May 21-26.

At Booth 828 in the Los Angeles Convention Center, UDC will exhibit its latest advancement in red, green and blue PHOLEDs with narrow emission spectral lineshape. The importance of narrow lineshape is to continue the advancement of increasing energy efficiency in addition to achieving enhanced color gamut.

UDC will also unveil to the public for the first time that its OVJP system printed on a 200mm x 500mm Corning Astra Glass substrate. The company will also showcase the first-ever fully printed seven-layer (HIL/HTL/EBL/EML/HBL/ETL/EIL), 80 PPI, green commercial-level PHOLED device fabricated by our R&D OVJP system that has comparable device performance with vacuum thermal evaporation (VTE).

“Innovation and invention are at the core of UDC’s DNA and we are continuing to build on our core competencies and pioneering work in phosphorescent materials and OLED technologies,” said Steven V. Abramson, president and CEO of Universal Display Corporation.

“We are pleased to share our latest leading-edge phosphorescent material data and showcase significant milestone achievements with our groundbreaking organic vapor jet printing system at SID Display Week,” Abramson added. “Scaling our dry printing technology to gen 4 while continuing to construct the building blocks of our alpha system and unveiling the first-ever fully printed PHOLED stack, consisting of 7 layers sequentially deposited with our OVJP platform, are important and exciting steps toward commercializing our trailblazing highly-efficient, cost-effective, high throughput manufacturing platform.”

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