Brewer Science Commercializes Thermal Slide Debonder for Compound Semiconductor Thin-Wafer Handling

Brewer Science announced the first commercial placement of its Cee 1300CSX thermal slide debonder. This debonder was purchased by an industry leader in the production of high-powered radio frequency (RF) components for use in wireless communications.

The Cee 1300CSX thermal debonder enables high-temperature slide-off debonding of thinned silicon and compound semiconductor substrates (including GaAs, GaN, InP, and SiC) from a rigid carrier to allow further processing of delicate thinned wafers. This debonding can be accomplished in a confidential laboratory setting without interrupting high-volume track production time and without investing large amounts of capital in additional automation.

“This commercial launch marks another strategic milestone in reducing the customer’s cost of ownership for thin-wafer handling through Brewer Science’s industry-leading equipment, temporary bonding materials, and process integration,” said Justin Furse, Brewer Science equipment technology strategist.