Optomec Adds Advanced Packaging Systems to Printed Electronics Lineup

Optomec announced the addition of two new Aerosol Jet additive manufacturing systems for production-level printed electronics. The new Aerosol Jet 300 and 470 Micro-Dispense (MD) Systems were developed specifically to address industry needs for advanced, high-density packaging and assembly methods to produce miniaturized electronic devices. The systems was unveiled at the 2014 IPC Apex Exposition held in Las Vegas this March.

The Aerosol Jet 300 MD system provides the ultimate in high resolution printed electronics capabilities required to manufacture smaller, lighter weight, high performance devices used in the consumer electronics, medical, aerospace and defense industries. Aerosol Jet can print features, including interconnects and pads, as small as 25 microns (1 mil), roughly 8 times smaller than most other dispense and jetting technologies, thereby enabling more electronic functionality in less space. The system can also print in 3D, such as vertical interconnects on stacked die for 3D Semiconductor integration and conformal electronics on physical structures to create smart devices. Optional, in-situ, IR Laser and UV cure solutions are available on both systems.

“The Aerosol Jet Micro-Dispense Series addresses customer requirements for high density electronic packaging needed to support shrinking electronic component and die sizes,” Mike O’Reilly, Optomec Aerosol Jet product manager, said. “Developed in conjunction with customers in the aerospace and defense industries, the new Aerosol Jet Micro Dispense Series is ideally suited to address batch production applications including component and die attach, underfill and component encapsulation, 3D interconnects for stacked die and other high density packaging needs. These systems bring the latest in additive manufacturing technology to the electronic packaging industry.”