Flexible Electronics News

Intrinsiq Materials Launches LAPS-60 Precision Sintering Systems

Systems can be customized to suit individual requirements

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By: DAVID SAVASTANO

Contributing Editor, Coatings World and Ink World

Intrinsiq Materials now provides a range of laser sintering systems and modules to suit a wide range of customer requirements and applications. Intrinsiq Materials CI series copper nanoparticle inkjet inks and CP series screen print pastes are designed for sintering by light pulse (photonic sintering) from either broad band flash or laser, depending on substrate and application.

Broadband flash systems are readily available from existing commercial suppliers; however, suitable laser systems generally have to be assembled from scratch, which can result in delays in integrating the copper ink technology into an application. To address this, Intrinsiq has offered its own LAPS-60 precision laser sintering systems for the last 18 months. The systems can be customized to suit a client’s individual requirements.

Developed over the last five years during the development of Intrinsiq inks and pastes, these laser sintering systems have proved popular with corporate R&D, research institutions and others who are active in the emerging field of printed electronics and are looking to develop and optimize applications, produce prototypes and demonstrators, or even small volume manufacture.

Intrinsiq now intends to extend its LAPS range to include more powerful lasers and systems designed for integration into R2R and sheet-to-sheet production systems to suit the client’s application and development requirements.

“A number of systems have been purchased by end-users keen to integrate Intrinsiq inks and laser sintering into their next generation products,” said Ian Clark, Intrinsiq’s sales and marketing director. “By offering an extended range of systems, similar to those used by Intrinsiq’s own development team, we are enabling ready adoption of our low cost innovative copper inks, providing a complete and flexible low cost solution versus existing processes.”

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