Flexible Electronics News

FlexTech Issues RFP for Thin Film Power Sources

Looking to fund recipients or teams to deliver or develop a TFPS as an engine for a functional electronic print device.

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By: DAVID SAVASTANO

Contributing Editor, Coatings World and Ink World

FlexTech Alliance issued a Request for Proposals (RFP) for Thin Film Power Sources. The purpose of this focused solicitation is to fund one or more recipients or teams to deliver or develop a Thin Flexible Power Source (TFPS) as an engine for a Functional Electronic Print (FEP) device.
 
A thin flexible power source is needed to power the FEP device and, at present, TFPS’ are at TRL 3 or 4, and a Manufacturing Readiness Level (MRL) of 2. In this solicitation, the TFPS must move to TRL 7/MRL 4 and be integrated with the FEP device to form a viable product.
 
Only full proposal responses to the RFP will be accepted by the due date of Wednesday, Jan. 6, 2016, 5:00 p.m. PST. The RFP can be accessed by following this link.

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