Aerosol Jet Deposition System for Multi-Chip Packaging to be Featured at IMAPS Device Packaging Conference

Optomec announced that Mike O’Reilly, Optomec’s Aerosol Jet product manager, will give a presentation on Aerosol Jet Deposition Technology for High Density, 3-D Interconnects for Multi-Chip Packaging at the IMAPS Device Packaging Conference on March 11, 2010. The conference will be held from March 9-11 at the Radisson Fort McDowell Resort and Casino in
Scottsdale/Fountain Hills, AZ.

Optomec and Vertcial Circuits Inc. have partnered together in developing a complete solution which addresses evolving 3-D semiconductor packaging complexities. Optomec’s patented Aerosol Jet technology is a maskless, non-contact material deposition system used to enable 3-D semiconductor packaging.

O’Reilly’s presentation will discuss the results of printing high density, 3-D interconnects printed on stacked die multi-chip packages which incorporate streaming video, communications and memory modules. Such packages are critical for meeting the increasing functional requirements of SmartPhones, personal entertainment, and other mobile devices.

O’Reilly’s presentation will explain how the Aerosol Jet system is used to deposit silver nanoparticle ink interconnects along the staircased sidewalls of staggered multi-chip die stacks.