Applied Materials Introduces Breakthrough Etch Technology for the Terabit Era

Applied Materials, Inc. advanced the state-of-the-art in etch technology with the launch of the Applied Centura Avatar dielectric etch system. This breakthrough system is designed to solve one of the most demanding challenges in creating the three-dimensional memory architectures that deliver the high-density, terabit storage capability required for tomorrow’s data-intensive mobile devices.

“With the Avatar system, we’ve capitalized on our leadership in plasma technology to address the unmet challenges of fabricating three-dimensional memory structures that require the etching of deep features in complex multi-layer material stacks,” said Dr. Prabu Raja, vice president and general manager of Applied’s Etch business group. “Customers are very enthusiastic about the breakthrough capabilities of this new system. We have already shipped more than 30 chambers to multiple customers for critical applications including the pilot production of future chips.”

The Avatar system etches the deep, narrow features that are a hallmark of 3D NAND memory arrays. These 3D arrays represent a new type of Flash device in which as many as 64 layers of memory cells are built up vertically to create extraordinary bit density in a small area.

The Avatar system can etch holes and trenches in complex film stacks with depth to width aspect ratios of up to 80:1. To illustrate this proportion, the aspect ratio of the Washington Monument is just 10:1. In addition, the system enables the simultaneous and precise etching of features with greatly varying depths – which is critical to fabricating the “staircase” contact structures that connect each layer of memory cells to the outside world.

The Avatar system is one of several new chipmaking technologies that will be showcased by Applied at SEMICON West 2012, to be held July 10-12, 2012.