Two Companies Develop Embedded Components Technologies

DKN Research, a research and engineering firm specializing in printable electronics, and NY Industries, a flexible circuit manufacturer, have co-developed a new embedded passive technology built on thin multi-layer thick film flexible substrates. This new embedded passive technology could prove to be valuable in the construction of printable flexible electronics.

One obstacle faced by design engineers, the companies say, is building electronic components on organic substrates. DKN Research and NY Industries offer what they call an Advanced Screen Printing (ASP) process package to build flexible electronics. Thick film circuits will be the basic technology for printable flexible electronics, they note. The printing process is said to provide fine patterns for not only conductor materials, but also dielectric and other functional materials in a few simple steps.

The thick film circuit process can build thin passive components, resistors, capacitors and inductors on substrates using a few combinations of a screen printing process. However, traditional thick film circuits have several limitations when building thin passive components due to low material performances and moderate capabilities from the printing processes.

The ASP process available from DKN Research and NY Industries uses a specially formed printable ink on heat resistant substrates (polyimide and PEN). The circuit system is available for single side, double, and multilayer circuits with various types of via holes. The APS process provides a range between 10 and 100 Mega ohms for printed resistors with a plus/minus accuracy of 10 percent. Printed capacitors are available for up to 5 nano Farads in a 50 square mm space. Over 100 turns of printed inductors are available with four layer thick film flexible circuits.

Several trials conducted using the ASP process to build embedded passive components showed a broad range capability in generating unique sensor modules on multi-layer flexible substrates.

DKN Research, based in Haverhill, MA, USA, develops and commercializes advanced packaging technologies and circuit technologies, specializing in thin flexible substrates.

NY Industries is a flexible circuit manufacturer in Ohtsu, Japan, with more than 30 years experience. The company has developed a range of screen printing processes for printable flexible electronics.