Optomec and Vertical Circuits Partner to Develop Ultra-Fine Pitch 3D Interconnect Solution

Optomec, Inc. and Vertical Circuits, Inc. (VCI) announced that they are collaborating in the development of a high density 3-dimensional interconnect solution that will enable multi-functional integrated circuits to be stacked and vertically interconnected in high performance Multi-Chip Packages (MCPs).

The solution will combine the unique fine feature capabilities of Optomec’s patented Aerosol Jet material deposition system with the cost and functional benefits of VCI’s patented Conformal Interconnect Technology, used currently in high density memory components and removable storage cards. The result will uniquely enable the combination of multiple memory devices plus logic and mixed signal ASIC’s into single packages with electrical/thermal performance, size, and cost benefits over alternative 3D technologies.

The solution is initially targeted to meet the continuing miniaturization needs of mobile communications product manufacturers, and will ultimately impact a broad range of devices that require cost effective, high performance, and small form factor component solutions. As part of the collaboration, Optomec has installed one of its standard systems at VCI, and the two companies are working closely together to optimize the solution for production in 2010.

“Vertical Circuits approach is to simplify the 3D product solution,” Simon McElrea, Vertical Circuit’s product development vice president, stated. “Our unique interconnect technology and process flow has been developed to significantly reduce the manufacturing complexity vs. traditional wire-bond and package-on-package (PoP) based solutions. Our conformal interconnect technology minimizes the package form factor and provides a short, high performance, signal path without the need to wait for complex TSV-based solutions. We are delighted to be working with Optomec, the leader in fine conductor application tools.”

The Aerosol Jet solution is ideally suited for production of fine pitch 3D conformal interconnects, since it is the only cost-effective technology capable of producing highly conductive traces as small as 10 micron over complex die stack geometries. Traditional multi-die packaging interconnect solutions such as wire bonding and PoP are complex and costly, and have limited scalability to support the higher frequency/short path signals required for next generation portable devices. Similarly, cost and time-to-market concerns remain a significant issue for emerging alternatives such as Through Silicon Via (TSV).

“We are delighted to work in close partnership with VCI to introduce this high value chip packaging solution,” Dave Ramahi, Optomec president and CEO, commented. “As a near-term, low-cost alternative to the future promise of Through Silicon Via, we believe our solution will soon see demand well beyond the needs of our initial mobile communications product applications.”