Flexible Electronics News

SEMI, ESIA Rally Support for European Semiconductor Strategy

Calls for an ambitious follow-up to the Chips Act that adds new R&D funds, attracts new investments, and increases European competitiveness.

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By: DAVID SAVASTANO

Contributing Editor, Coatings World and Ink World

Seeking to explore semiconductor policy measures that can strengthen the industrial policy in the European Union, SEMI and the European Semiconductor Industry Association (ESIA) have successfully held a high-level roundtable event in the European Parliament under the auspices of Members of the European Parliament (MEPs) Bart Groothuis (Renew Europe), Oliver Schenk (European People’s Party) and Dan Nica (Socialists and Democrats Party).

The 2023 European Chips Act marked an important milestone for Europe’s semiconductor industry and overall industrial ecosystem, providing concrete measures to enhance competitiveness and technological capabilities.

To build on the success of the Chips Act, after the roundtable, MEPs signed a joint declaration to Henna Virkkunen, the European Commission’s EVP for tech sovereignty, security and democracy, calling for an ambitious follow-up to the Chips Act that adds new research and development (R&D) funds, attracts new investments, and increases European competitiveness.

“The creation of a new European semiconductor strategy was a focal point of the discussion today, emphasizing on the increasing need to boost the technological capabilities and accelerate innovation across the European semiconductor ecosystem,” said Laith Altimime, president, SEMI Europe.

SEMI and ESIA strongly appreciate the ongoing initiatives of European policymakers, together with the progress already made to bolster the European semiconductor ecosystem. Nevertheless, the European semiconductor ecosystem requires a holistic approach that supports semiconductor design and manufacturing, R&D, materials and equipment capabilities.

“Our sector sees three priorities: We need a clear European semiconductor strategy that is backed by a revised European Chips Act with more quickly advancing administrative procedures,” said ESIA VP Frédérique Le Grevès. “Secondly, we must identify the right approach to trade and foreign policy leading to more resilience, and thirdly, continue our focus on fostering innovation.”

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