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DIC to Participate in TOKYO PACK 2024

A total of 27 products and solutions will be featured, in line with the theme ‘A new step toward sustainable packaging for the future.’

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By: DAVID SAVASTANO

Contributing Editor, Coatings World and Ink World

DIC Corporation announced that it will participate, together with subsidiary DIC Graphics Corpo-ration, in the Tokyo International Packaging Exhibition 2024 (TOKYO PACK 2024), which will be held from Oct. 23-25, 2024, at the Tokyo International Exhibition Center (Tokyo Big Sight). The company has also created a dedicated TOKYO PACK 2024 page on its global website that intro-duces the products and solutions displayed at its on-site booth.

The DIC Group deploys a variety of initiatives in the packaging field aimed at contributing to the achievement of sustainability for the earth and society in line with its proprietary 5Rs frame-work, which adds “renew” and “redesign” to the original 3Rs (“reuse, reduce, recycle”).

The DIC Group’s TOKYO PACK 2024 on-site booth and dedicated website page will feature a to-tal of 27 products and solutions, including through a collaborative exhibit with partner compa-nies, in line with the theme “A new step toward sustainable packaging for the future.”
Examples of collaborative exhibit products and solutions include:

• A solution that encourages recycling by combining DIC’s top-seal technologies (including those for easy-peel sealant film) with state-of-the-art printing technologies from a partner company
• An innovative lamination system employing DIC’s DUALAM solvent-fee adhesive that helps reduce CO2 emissions developed jointly with a partner company

A variety of mini-presentations providing useful information for visitors are also scheduled to be held at the DIC Group’s on-site booth.

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