University Session Sponsored by The Photopolymerization Conference at RadTech 2018

RadTech announced a new collaboration with The Photopolymerization Fundamentals Conference, the premier scientific meeting for academic and industrial participants, which will feature presentations on the latest research on novel and fundamental questions related to photopolymerization.
 
At RadTech 2018, which takes place May 7-9, 2018 in Chicago, leading UV+EB researchers from six universities – as well as the Air Force Research Laboratory – will present their recent research on critical results, and findings that may aid product development. 
 
Talks will highlight emerging applications and materials platforms including high-performance fibers, self-assembly, novel polymerization systems and methods of controlling network structure and properties, photo-responsive networks, click chemistry, and light activated dark cure.

The session will include the following presentations:

High Performance Fibers via Simultaneous Fiber Spinning and Photopolymerization
Christopher Ellison, University of Minnesota

Controlling network structure and thermomechanical properties of photopolymerized networks through prepolymer architecture
Allan Guymon, University of Iowa

Free-radical polymerization using a photobase/redox initiating system to provide light-activated dark cure
Jeff Stansbury, University of Colorado

Photoinitiated Interpenetrating Triazole-Methacrylate Networks
Chris Kloxin, University of Delaware

Volumetric Photopolymerization Confinement with Wavelength-selective Photoinitiation and Photoinhibition
Tim Scott, University of Michigan

Ambient and Switchable plasticity in thiol-X photopolymers
Matt McBride, University of Colorado

Photopolymerization and Aza-Michael click addition for highly homogeneous photopolymer networks and smart materials
Ahmad Ibrahim, University of Haute Alsace

Pixelated Polymers: Directing the Self-Assembly of Liquid Crystalline Elastomers
Brian Donovan, Air Force Research Laboratory

The RadTech 2018 Conference Program features over 100 additional presentations and nearly 80 exhibitors offering the latest advancements in the science and application of UV+EB technology, widely used in applications including electronics, 3D printing, food packaging, automotive and aerospace, medical, and a wide range of other industrial applications.