RadTech 2022 Heads Into Second Day
05.10.22
There will be eight concurrent sessions, including three sessions on Next Level Formulations, Kinetics, and Optimized Materials.
The RadTech 2022 conference continues at the Hyatt Regency Orlando today, with eight concurrent sessions, including three tracks on Next Level Formulations.
The early morning sessions begin at 8 a.m., starting with three concurrent sessions: Next Level Formulations I, Analytical and Introduction to the Basics of UV/EB Curing.
Track 4A features Next Level Formulations I, with presentations by Bruce Fillipo, Ashland; Marcus Hutchins, Allnex; Richard Plenderleith, Sartomer; and Camila Baroni, IGM Resins.
Analytical, Track 4B, will offer presentations by Paul Share, Advanced Materials Design and Issei Takahashi, Mitsuichemicals.Inc / University of Haute Alsace. Track 4C features Introduction to the Basics of UV/EB Curing, led by Dr. Mike Idacavage of Radical Curing, LLC.
Following a pair of panel discussions, the conference returns with sessions on Next Level Formulations II, Kinetics and Optimized Materials.
Next Level Formulations II, Track 5A, will feature talks by Brent Laurenti, BYK USA; Tong Wang, Allnex; Kai Yang, Evonik and Jason Ghaderi, IGM Resins. Track 5B, Kinetics, will be covered by Noah Menard, Veritas Testing and Consulting; and Julie Jessop, Mississippi State University.
Track 5C, Optimized Materials, will feature Christopher Cayer, Bomar; Paul Snowwhite, 7D Innovators; Endrit Shurdha, Sartomer; and Joe Lichtenhan, Hybrid Plastics Inc.
Track 6A, Next Level Formulations III, will be discussed by Joe Lichtenhan, Hybrid Plastics Inc.; Kai Yang, Evonik Corporation; Kristy Wagner, Red Spot Paint; and Mike Idacavage, Radical Curing LLC. Specialty Applications, Track 6B, will offer insights from Jeremy Yatvin, allnex USA Inc.; Jonathan Shaw, allnex USA Inc.; Adreann Peel, University of Iowa; and Eric Nelson, Heraeus Noblelight America.
The early morning sessions begin at 8 a.m., starting with three concurrent sessions: Next Level Formulations I, Analytical and Introduction to the Basics of UV/EB Curing.
Track 4A features Next Level Formulations I, with presentations by Bruce Fillipo, Ashland; Marcus Hutchins, Allnex; Richard Plenderleith, Sartomer; and Camila Baroni, IGM Resins.
Analytical, Track 4B, will offer presentations by Paul Share, Advanced Materials Design and Issei Takahashi, Mitsuichemicals.Inc / University of Haute Alsace. Track 4C features Introduction to the Basics of UV/EB Curing, led by Dr. Mike Idacavage of Radical Curing, LLC.
Following a pair of panel discussions, the conference returns with sessions on Next Level Formulations II, Kinetics and Optimized Materials.
Next Level Formulations II, Track 5A, will feature talks by Brent Laurenti, BYK USA; Tong Wang, Allnex; Kai Yang, Evonik and Jason Ghaderi, IGM Resins. Track 5B, Kinetics, will be covered by Noah Menard, Veritas Testing and Consulting; and Julie Jessop, Mississippi State University.
Track 5C, Optimized Materials, will feature Christopher Cayer, Bomar; Paul Snowwhite, 7D Innovators; Endrit Shurdha, Sartomer; and Joe Lichtenhan, Hybrid Plastics Inc.
Track 6A, Next Level Formulations III, will be discussed by Joe Lichtenhan, Hybrid Plastics Inc.; Kai Yang, Evonik Corporation; Kristy Wagner, Red Spot Paint; and Mike Idacavage, Radical Curing LLC. Specialty Applications, Track 6B, will offer insights from Jeremy Yatvin, allnex USA Inc.; Jonathan Shaw, allnex USA Inc.; Adreann Peel, University of Iowa; and Eric Nelson, Heraeus Noblelight America.
