From May 15-18, RadTech International North America, The Association for Ultraviolet and Electron Beam Technologies, is hosting its biennial show, RadTech UV+EB 2016 Technology Expo and Conference. RadTech 2016 will be held at the Hyatt Regency O’Hare in Chicago, IL.
With five short courses, 22 Technical Conference tracks, five Special Sessions and more than 80 exhibitors, RadTech 2016 is billed as the world’s largest event dedicated to UV and EB technologies. With speakers from P&G, Ford Motor Company, Toyota, PepsiCo and Nestlé, among others, RadTech 2016 will have plenty of information for attendees looking to use UV, UV LED and EB for their applications.
RadTech 2016 begins on May 15 with four short courses: All You Ever Wanted to Know (and more) About UV-C LEDs and Applications; UV/EB Professional Short Course (Undergraduate-Level); Advanced Photopolymerization Topics (Graduate level); and Click Chemistry in Radiation Curing, led by Christopher N. Bowman, University of Colorado Boulder.
There is an additional Short Course, Design of Experiments for UV/EB Scientists and Engineers, which will be held May 16 and May 17. In addition, there will be an Introduction to the Basics of UV/EB Curing held on the mornings of May 16 and May 17.
May 16 Sessions
The Technical Conference splits into two tracks on May 16. Track A is focused more on graphic arts, featuring sessions on 3D Printing (speakers from Dymax Oligomers & Coatings, HRL Labs, Sartomer and Siltech); Specialty Applications (Korea Research Institute of Chemical Technology, Lipscomb University, China General Nuclear and University of Houston-Downtown); Printing & Packaging (BASF, Nazdar, EIT and Phoseon Technology); and Digital Printing (BASF, Fujifilm Dimatix, Jiangnan University and SPF Inc.)
Track B will cover four topics relating to paint and coatings and adhesives: Formulation (presenters from Colorado Photopolymer Solutions (CPS), Myriant and University of Iowa); Hardcoats (Allnex and Momentive Performance Materials); Coatings (Lipscomb University); and Adhesives (Arkema Inc., Sartomer Business Unit, KIWO, EIT, Novagard Solutions and Sidney Hutter Glass & Light Inc.)
The five Special Sessions feature a mix of end users and leading suppliers.
Advanced Technology for UV Wood Applications will offer talks by Mike Higgins of Phoseon, Jim Arvin of DuBois Equipment Company and Roy Pagan, Cefla North America – Finishing Division.
3D is a major topic for UV, and the panel discussion covering the Latest Advancements in 3D Printing Using UV Technologies will feature Victor Latour of Stoopid Buddy Stoodios; Sumeet Jain of Arkema Inc., Sartomer Business Unit; Lance Pickens of MadeSolid; Mike Idacavage of Colorado Photopolymer Solutions; Brian Adzima of Autodesk; and Alex Mejiritski of Spectra Group Limited.
Material Innovation: A Discussion with Consumer Product Companies, which will look at how companies analyze and choose new technologies, including UV and EB, should be a particular highlight. Dr. Sharon Tracy of Steelcase Inc., Alrick Warner of P&G, Christopher Seubert of Ford Motor Company, Todd Fayne of Pepsi Co. and 3M’s Robin Wright will provide their insights into this topic.
UV/EB Curing for Automotive Applications should be another strong session, with Ford Motor Company’s Seubert, and Cynthia Templeman, Toyota Motor Engineering & Manufacturing North America, scheduled to offer their thoughts on potential uses for energy curing in the automotive market.
The fifth session is UV Hydrogel Medical, Industrial, and Developing Applications, which will be covered by Beth Rundlett, Katcheco; Robin Wright, 3M and Allan Guymon, University of Iowa. A reception on the exhibition floor will follow.
May 17 Sessions
As was the case during Day 1, May 17 features two Technical Conference tracks. Track A will have sessions on Chemistry (University of Colorado Boulder and University of Iowa); Electron Beam Technology for Packaging Applications (Energy Sciences,, Sun Chemical, Comet Group and PepsiCo); Raw Materials I (Allnex, Dymax and Sartomer Americas); and Raw Materials II (Allnex, Institute of Materials Research, Myriant and Rensselaer Polytechnic Institute.
Track B will cover topics ranging from Advances in Electron Beam Equipment and Applications (Cleveland Steel Container, PCT Engineered Systems, IdeOn LLC and Collins Inkjet); EHS & Regulatory (RAHN USA, Colorado Photopolymer Solutions and RadTech); Deep UV LED (Excelitas and Osaka Prefecture University); and Equipment (CPS, EIT Instrument Markets, Kopp Glass and Porex).
Once again, the Special Session offer perspectives from end users and suppliers alike on important topics. The Food Packaging Panel will feature perspectives from Dr. Stephen Klump of Nestlé; Nick Ivory of Sun Chemical; Peter Walther of Siegwerk; and Don Duncan of Wikoff Color.
The other two Special Sessions will look at new technologies from key suppliers. New Product Debut I will showcase Phoseon Technology, Hampford Research, PCT Engineered Systems, GEW, Inc., Nichia, Enercon Industries, Alberdingk Boley, RAHN USA, Miwon Specialty Chemical Co. and Kopp Glass.
New Product Debut II will highlight products from Allnex, Lambson Limited UK, EIT LLC, Mettler-Toledo, Digital Light Lab, Sartomer Americas, Red Spot Paint & Varnish and BASF.
May 18 Sessions
On May 18, the final six Technical Conference Sessions will be offered in two concurrent tracks. Track A will cover Low-Gloss/Haptic Coatings (Allnex, Evonik and Sartomer Americas); Composites ((SUNY ESF and Unimin); and Global Market Overview.
Track B will offer sessions on Photoinitiator (Great Lakes Fine Chemicals, Hampford Research, IGM Resins and Momentive Performance Materials); Waterborne (Alberdingk Boley, Miwon Specialty Chemical Co., PCT Engineered Systems and Wood Coatings Research Group); and Cure Studies (Heraeus Noblelight America, University of Iowa, Rensselaer Polytechnic Institute).