01.22.19
Harper Corporation of America will participate as an exhibitor and speaker at “The Future of Flexo: New Year, New Technology,” an open house presented by OMET Americas.
This free event will be held at Clemson University’s Sonoco Institute of Packaging Design and Graphics, which includes a Varyflex narrow web press by OMET in its Advanced Print Lab. Harper Corporation of America is a sponsor of the event.
In addition, Sean Teufler, technical director at Harper, will be presenting on “New Technology and Understanding Coating Applications.”
The event will be held Feb. 6-7, 2019 at Clemson University’s Sonoco Institute, Clemson, SC.
This free event will be held at Clemson University’s Sonoco Institute of Packaging Design and Graphics, which includes a Varyflex narrow web press by OMET in its Advanced Print Lab. Harper Corporation of America is a sponsor of the event.
In addition, Sean Teufler, technical director at Harper, will be presenting on “New Technology and Understanding Coating Applications.”
The event will be held Feb. 6-7, 2019 at Clemson University’s Sonoco Institute, Clemson, SC.